TSP 5000 Series Thermal Soft Pad

Material Features High Performance,Thermally Conductive Gap Filling Material

As low as $283.2/m at 0% APR With paypal_credit

Describe： This flexible series is an electrically insulating thermally conductive high performance silicone gap filler. It is ideal for use in applications where a very good thermal transfer over large gaps caused e.g. by big tole_x005frances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the silicone elastomer has an extremely high thermal conductivity. Through its softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at low pressure. By its use the total thermal resistance is minimized. The natural tackiness of the material allows for an easy and reliable pre-assembly.

Thermal conductivity 2.0~3.0 W/m·K
"Low “S-Class” thermal resistance at very low pressures"
Highly conformable, low hardness
Designed for low-stress applications
"Fiberglass reinforced for puncture, shear and tear resistance"

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PROPERTIES	UNITS	TSP5045	TSP5055	TSP5050LV	TSP5025
Color	-	Violet	Violet	Violet	Violet
Thickness	mm	0.25~10	0.25~10	0.25~10	0.25~10
Thermal Conductivity	W/m·K	5	5	5	5
Thermal Resistance @1mm,20psi	°C·in2/W	0.27	0.27	0.27	0.24
Thermal Resistance @1mm,20psi	°C·cm2/W	1.74	1.74	1.74	1.55
Hardness	Shore OO	45(1）	55	50	25
Flame Rating	-	V0	V0	V0	V0
Dielectric Strength	kV(@1mm)	>9.0	>9.0	>9.0	>9.0
Volume Resistivity	Ω·cm	≥1.0×1013	≥1.0×1013	≥1.0×1013	≥1.0×1013
Density	g/cm3	3.1	3.1	3.1	3.1
Tensile Strength	psi	45	52	52	52
Elongation	%	50	50	50	50
Compression Deflection (%) at given pressure	10 psi	13	12	12	15
	50 psi	35	32	32	38
	100 psi	55	50	50	60
Dielectric Constant	@1MHz	6	6.5	6	6.5
TML（CVCM）	%	≤0.15(0.04)	≤0.15(0.04)	≤0.15(0.04)	≤0.15(0.04)
Service Temp.	℃	-60~200	-60~200	-60~200	-60~200
RoHS/REACH	-	compliance	compliance	compliance	compliance